Does anyone have experience with PBGA type packaging related to noise/EMI
and suseptability?
I have concerns with the internal ground/pwr ring, trace spacing/width,
via size, package size ... etc.
Can anyone share with me their experience.
Do you know of alternatives of/to PBA package types for low noise??
regards
ac
--------------------------------------------------------------------------
| M O T O R O L A - Advanced Microcontroller Division (AMCU) |
| ------------------------------------------------------------------------ |
| Art Collard Modular Circuit Design email: [email protected]|
| ------------------------------------------------------------------------ |
| Mail Drop: OE320 |
| Motorola - Advanced Microcontroller Division |
| 6501 William Cannon Drive West, Austin, Texas 78735-8598 |
| Tel: (512)891-8651 Fax: (512)891-3348 Pager: (512)933-7333 pgr# 89-8651|
--------------------------------------------------------------------------