We have several papers on ground plane modeling and analysis that maybe interest to you.
Also, Quad has a new tool called AC_GRADE for power/ground plane characterization and
simulation, as well as the decoupling strategy. Let me know if you are interested so I
can provide more information.
 F. Y. Yuan, T. Postel, and L. Rubin, "Analysis and Modeling of Power Distribution Networks
and Plane Structures in Multichip Modules and PCB's", IEEE International Symposium on
Electromagnetic Compatibility, pp. 447-452, Atlanta, Georgia, Aug. 1995.
 F. Y. Yuan, "Analysis and Simulation of Complex Interconnect Structures and Power/Ground
Distribution Networks in MCM and PCB's" IEEE 4th Topical Meeting on Electrical Performance of
Electronic Packaging (EPEP'95), pp. 84-88, Portland, Oregon, Oct. 1995.
 F. Y. Yuan, C-W Lam, and L. Rubin, "Power and Ground Plane Modeling and Decoupling in
High Speed Printed Circuit Board and Multichip Modules", Proceedings of 12th Annual Review
of Progress in Applied Computational Electromagnetic (ACES'96), pp. 888-896, Monterey,
California, March 1996.
 H. Shi, F. Yuan, F. Sha, J. Drewniak, T. Hubing, and T. Van Doren, "Simulation and
Measurements for Decoupling on Multilayer DC Power Buses", to appear at IEEE International
Symposium on Electromagnetic Compatibility, Santa Clara, California, Aug. 1996.
 F. Y. Yuan, "Signal Integrity Analysis of Simultaneous Switching Noises and Decoupling
Capacitors in Digital Packages and PCB Systems", to appear at IEEE 5th Topical Meeting on
Electrical Performance of Electronic Packaging (EPEP'96), Napa, California, Oct. 1996.
 E. Tuncer, C-W. Lam, and F. Yuan, "Modeling Ground Plane Cuts Using Transmission Line
Theory", to appear at IEEE 5th Topical Meeting on Electrical Performance of Electronic
Packaging (EPEP'96), California, Oct. 1996.
Frank Y. Yuan, Ph.D.
Member of Technical Staff Tel: (805)988-8250
Quad Design Technoloyg, Inc Fax: (805)988-8259
Camarillo, California Email: firstname.lastname@example.org