FWD: ASIC DESIGNER: case temperture OR ambient temperture...?

Ray Anderson (raymonda@radium)
Thu, 25 Jul 1996 10:07:28 +0800

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>From yehuda@lisa.chipx.co.il Thu Jul 25 06:23:20 1996
Subject: ASIC DESIGNER: case temperture OR ambient temperture...?
To: si-admin@silab.Eng.Sun.COM
Date: Thu, 25 Jul 96 16:24:52 EET
From: "Yehuda D. Yizraeli" <yehuda@chipx.co.il>
Reply-To: yehuda@chipx.co.il
Organization: Chip-Express
Mailer: Elm [revision: 70.85]
Content-Length: 1547

Hi,

I tried si-list and the mail was bounced back, can u help distribute it.


regards, yehuda

>
> Dear ASIC designer,
>
>
> Back in the past, we were used to see all thermal data for packages in
> TETA_Junction_air. Nowadays, when all parts consume more heat due to
> size and operating frequency, more and more companies are using
> TETA_Junction_case.
>
> My question to the ASIC designer and/or ASIC manufacturer is how do u
> find this change common to the ASIC world. Does this trend acceptable or
> not for u as a designer or u as an ASIC manufacturer..?
>
>
>
> I will very much appreciate answering the list AND directly to me too.
>
>
>
>
>
>
> best regards, yehuda

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