Announcement of Short Course

Shirley Dipert (sdipert@decwa.ece.uiuc.edu)
Thu, 4 Apr 1996 11:06:27 -0600

ANNOUNCEMENT OF SHORT COURSE
Please circulate to your friends and colleagues

The 4th offering of
ELECTRICAL MODELING, SIMULATION, AND DESIGN OF
ELECTRONIC PACKAGES

An Intensive Three-Day Short Course

with Raj Mittra, Paul Franzon, and Dale Becker

October 23-25, 1996 * San Jose, California

COURSE DESCRIPTION
This three-day short course will provide an in-depth coverage of numerous
aspects of electrical modeling, simulation and design of electronic
packages. Various design options will be discussed and the electrical
issues in package design will be identified. Detailed design procedures
will be outlined and the use of CAD/CAE tools for package layout will be
described. Techniques for electromagnetic modeling and simulation of
interconnects, multiconductor transmission lines, and discontinuities in
these lines, e.g., bends, tapers and vias, will be presented. Methods for
estimating the power and ground plane noise and spurious radiation from the
package will also be discussed.

LECTURERS
Dale Becker is an Advisory Engineer in the System 390 Division of IBM in
Poughkeepsie, NY. He is responsible for the electrical design of the MCMs,
SCMs, boards and cards that are used in IBM's mainframe computers. He has
fourteen years experience applying electromagnetic numerical methods to the
issues of signal integrity and simultaneous switching noise in electronic
packaging. Dr. Becker's current interests are the electrical modeling of
packaged CMOS chips in a computer system environment, and the laboratory
verification of the models and the modeling approaches.

Paul Franzon is an associate professor in the Department of Electrical and
Computer Engineering at North Carolina State University. He has over eight
years experience in electronic systems design and design methodology
research and development including working at AT&T Bell Laboratories and as
the founding member of a communications company. Dr. Franzon's current
research interests focus on the design sciences/methodology for high-speed
packaging and interconnect, and also for high-speed and low-power chip
design. He is a consultant to a number of companies in these areas and has
extensive experience in teaching related professional courses.

Raj Mittra is a professor in the Department of Electrical and Computer
Engineering at the University of Illinois at Urbana-Champaign and director
of the Electromagnetic Commun-ication Laboratory. He has directed many
short courses on computational electromagnetics, both in the U.S. and in
Europe, and has offered on-site seminar series at several industrial
locations including GTE Network Systems, Cray Research, DEC, IBM and Intel.
He has authored and co-authored over 400 research papers and 20 textbooks.
He has served the IEEE AP-S Society as a National Distinguished Lecturer,
as president, and as an editor of the IEEE Transactions on Antennas and
Propagation. He also heads RM Associates, a company that provides
consulting services to many government and industrial organizations.

GENERAL INFORMATION

For further information telephone Raj Mittra at 217-333-1202 or FAX
217-333-8986 or e-mail: rmittra@decwa.ece.uiuc.edu

Location: The course will be held at the Radisson Hotel, 1471 North Fourth
Street, San Jose, CA 95112. The telephone number is 408-452-0200.

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Raj Mittra, Director
Electromagnetic Communication Laboratory, University of Illinois
1406 W. Green Street, Urbana, IL, 61801-2991

Phone:217-333-1202; Fax:217-333-8986 or 333-7427
e-mail: rmittra@decwa.ece.uiuc.edu
Secretary - Shirley A. Dipert, Phone:217-333-1200; Fax: 217-333-5962
e-mail: sdipert@decwa.ece.uiuc.edu