RE: [SI-LIST] : Thin Power Plane Dielectrics

Grasso, Charles (GrassC@LOUISVILLE.STORTEK.COM)
Sat, 16 Oct 1999 22:05:33 -0600

To all who may be interested:

NCMS is currently deeply involved in a cooperative effort with industry to
develop Embedded Capacitance. The "Buried Capacitance" is a subset
of this effort.

Rick Charbonneau of StorageTek is the Project Leader and also a
materials expert in this area. Please feel free to contact him directly..
Thank you
Charles Grasso
StorageTek
2270 Sth 88th Street
Louisville CO 80027
Tel: (303)673-2908
Fax(303)661-7115

> ----------
> From: Patterson, Ken[SMTP:Ken_Patterson@adc.com]
> Sent: Friday, October 15, 1999 1:15 PM
> To: si-list@silab.eng.sun.com
> Subject: RE: [SI-LIST] : Thin Power Plane Dielectrics
>
> Ray,
>
> Look into a board house called Automata located on the east
> coast(Sterling, VA) http://www.automata.com. They were one of the first
> board houses starting to use Zycon. They have very good quality and
> process standards and claim to get about 500pf/in^2 for the buried
> capacitance. Their web site has some good application info on these
> topics. They have been manufacturing our high density boards here with
> great success. Our multimedia hardware uses a 3 mil dielectric between
> power and ground. We have not had any problems with this process so far.
>
> Regards,
>
> Ken
>
> Ken Patterson
> Sr. Electronic Engineer
> ADC/Pathway
> 777 Beta Dr.
> Mayfield Village, Ohio 44143
> (440)473-0270
>
>
>
>
> -----Original Message-----
> From: Ray Anderson [mailto:raymonda@radium.eng.sun.com]
> Sent: Friday, October 15, 1999 3:37 PM
> To: si-list@silab.eng.sun.com
> Subject: [SI-LIST] : Thin Power Plane Dielectrics
>
>
>
> Recently I've been looking at utilizing ultra-thin dielectrics between
> power planes (like Hadco/Zycon BC Buried Capacitance material and others
> based on alternate technologies) to minimize the spreading inductance the
> planes add to the power distribution system. Some designers utilize this
> material because of the increased capacitance per unit area it provides.
>
> It would appear that as one uses thinner and thinner dielectrics for
> improved electrical performance that reliability will begin to suffer
> at some point due to the imperfect nature of thin dielectrics over large
> areas.
>
> I was wondering if anyone has any comments and/or success/horror stories
> associated with the use of these ultra-thin dielectric layers in PCB's?
>
>
> Ray Anderson
> Sun Microsystems
>
>
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