[SI-LIST] : RE: Another decoupling question

Greim, Michael (mgreim@mc.com)
Thu, 16 Sep 1999 08:49:55 -0400

Michael C. Greim Consulting Engineer
Mercury Computer Systems, Inc email: mgreim@mc.com
199 Riverneck Road V:
978-256-0052/x1607
Chelmsford, MA 01824-2820 F: 978-256-4778

> -----Original Message-----
> From: Volk, Andrew M [SMTP:andrew.m.volk@intel.com]
> Sent: Wednesday, September 15, 1999 5:04 PM
> To: 'si-list@silab.eng.sun.com'
> Subject: RE: Another decoupling question
>
> SI Listeners -
>
> Another question on decoupling. I have recently heard about capacitors
> that are supposedly thin enough to fit under a standard MBGA package
> (Novacap for one). This would give excellent decoupling as it is close to
> the package power balls, but still mounts on the top of the board avoiding
> backside components.
>
> Has anyone had any experience with this type of device and this kind of
> manufacturing step (cap under BGA package)?
>
> Andrew Volk
> Intel Corp.

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