[SI-LIST] : RE: Another decoupling question

Volk, Andrew M (andrew.m.volk@intel.com)
Wed, 15 Sep 1999 14:04:20 -0700

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SI Listeners -

Another question on decoupling. I have recently heard about capacitors that
are supposedly thin enough to fit under a standard MBGA package (Novacap for
one). This would give excellent decoupling as it is close to the package
power balls, but still mounts on the top of the board avoiding backside
components.

Has anyone had any experience with this type of device and this kind of
manufacturing step (cap under BGA package)?

Andrew Volk
Intel Corp.

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