This is an interesting topic! We have never used the "picket fence," as you
call it reduce crosstalk, but rather have used it to stitch ground planes
together at the edge of boards.
The only published reference that I am aware of on this subject is [Kim,
1995] that I cite below.
Kim shows that crosstalk attenuation in excess of 20 dB can be obtained with
a double row of plated hole vias with 30 mil diameters and 100 mil spacing.
His setup had parallel microstrip traces with the via fence between them.
Kim was concerned about frequencies between 500 MHz and 6 GHz.
Kim, Myung-Kul, "Crosstalk Control for Microstrip Circuits on PCBs at
Microwave Frequencies," IEEE 1995 International Symposium on Electromagnetic
Compatibility, pp. 459-464.
Please share whatever wisdom you glean from this quest.
Dr. Jim Knighten e-mail: Jim.Knighten@SanDiegoCA.NCR.com
Senior Consulting Engineer
17095 Via del Campo
San Diego, CA 92127 http://www.ncr.com <http://www.ncr.com>
***** Notice the Area Code change from 619 *****
From: Elya B. Joffe [mailto:email@example.com]
Sent: Thursday, September 02, 1999 10:44 AM
To: Elya B. Joffe; firstname.lastname@example.org; Vinu
Arumugham; email@example.com; John Lin - TAO; Howard Johnson; Gert Winkler;
Ron Matthews; Roland F. Portman
Subject: [SI-LIST] : "Picket Fence" (Via Fence) for
increasing isolation between
I am involved in a project where we must apply the technique
"Picket Fence" (Via Fence) for increasing isolation between
conductors on a PCB.
I cannot find any refercnes (papers, books, etc.) on that
you familiar with anything on that issue? The problem,
- how much isolation can we get between conductors embedded
ground planes, or between ground and power planes, when they
"isolated" by a "picket/via fence".
If you have come across such material, or references, I
grateful if you could refer me to them. I have gone through
"classics" and could find nothing there, and I need some
for the work we are involved in...
Elya B. Joffe - EMC Engineer
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