RE: [SI-LIST] : "Picket Fence" (Via Fence) for increasing isolati

Grasso, Charles (GrassC@LOUISVILLE.STORTEK.COM)
Thu, 2 Sep 1999 13:22:29 -0600

Hello!!
I belive this techniques was pioneered by W. M. King.
I have included his e-mail address. He will be glad to
help.
Thank you
Charles Grasso
Advisory Engineer
StorageTek
1 StorageTek Drive
Louisville CO 80027 M/S 4247.
Tel:303-673-2908
Fax:303-661-7115
email:grassc@louisville.stortek.com
RMCEMC Web Site: http://www.ewh.ieee.org/r5/denver/rockymountainemc/

-----Original Message-----
From: Elya B. Joffe [mailto:ebj@netvision.net.il]
Sent: Thursday, September 02, 1999 11:44 AM
To: Elya B. Joffe; si-list@silab.eng.sun.com; Vinu Arumugham;
yehuda@zoran.co.il; John Lin - TAO; Howard Johnson; Gert Winkler; Ron
Matthews; Roland F. Portman
Subject: [SI-LIST] : "Picket Fence" (Via Fence) for increasing isolation
between

Dear Members,

I am involved in a project where we must apply the technique of
"Picket Fence" (Via Fence) for increasing isolation between
conductors on a PCB.

I cannot find any refercnes (papers, books, etc.) on that issue. Are
you familiar with anything on that issue? The problem, basically, is
- how much isolation can we get between conductors embedded between
ground planes, or between ground and power planes, when they are
"isolated" by a "picket/via fence".

If you have come across such material, or references, I would be
grateful if you could refer me to them. I have gone through the
"classics" and could find nothing there, and I need some references
for the work we are involved in...

Elya B. Joffe - EMC Engineer

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