RE: [SI-LIST] : BGA socket modeling

Tan, Tat Hin (tat.hin.tan@intel.com)
Thu, 02 Sep 1999 12:11:38 -0700

Hi Russell,

Not advertising this company but it has a very good article on frequency
domain characterization methodology.
http://www.gigatest.com/hp96.html

For TDR methods refer to
AN1304-1 and AN1304-2 from
http://www.tmo.hp.com/tmo/Notes/English/NotesANumber.html
or visit Tektronix http://www.tek.com

I prefer to use TDR method as it gives unique values for LCR and it's
simpler. FD method uses MDS optimization algorithms to arrive at the LCR
values but I wonder if they are unique. FD method does give better
correlation if one uses higher order polynomials as models instead of
simple
LCR model.

Warning: R is quite difficult to determine. And is dependent upon the
wear
and tear on the socket pin contact with the pad, as well as contact
pressure.

rgrds,
t^2h
Intel Test Tooling Penang

-----Original Message-----
From: Matt (boomer) Russell [mailto:boomer@lsil.com]
Sent: Thursday, September 02, 1999 3:13 AM
To: 'si-list@silab.eng.sun.com'
Subject: [SI-LIST] : BGA socket modeling

Hi,

anyone have any approximate figures for BGA test socket LRC values
or how to model it.

I am trying to get info from the socket vendor, but all I seem
to be able to get is contact resistance and mechanical info.

matt

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