Re: [SI-LIST] : BGA socket modeling

Dima Smolyansky (dima@tdasystems.com)
Wed, 1 Sep 1999 16:46:53 -0700

Matt:

In addition to what Scott said, differential TDR measurements will make the
task even easier. Furthermore, there is commercial software available that
extracts package interconnect models from TDR data.

Thanks,

-Dima
=================
Dima Smolyansky
Time Domain Analysis Systems, Inc.
7465 SW Elmwood St.
Portland, OR 97223
(503) 977-3629
(503) 804-7171 (mobile)
(503) 245-5684 (fax)
www.tdasystems.com
The Interconnect Modeling Company (TM)

-----Original Message-----
From: Scott McMorrow <scott@vasthorizons.com>
To: si-list@silab.eng.sun.com <si-list@silab.eng.sun.com>
Date: Wednesday, September 01, 1999 3:01 PM
Subject: Re: [SI-LIST] : BGA socket modeling

>Matt,
>
>Your best bet is to use a TDR to take actual measurements
>to create a model from. You will have to take measurements of
>all pins in order to get a useful bounds on the min and max
>parasitics.
>
>
>regards,
>
>scott
>
>"Matt (boomer) Russell" wrote:
>
>> Hi,
>>
>> anyone have any approximate figures for BGA test socket LRC values
>> or how to model it.
>>
>> I am trying to get info from the socket vendor, but all I seem
>> to be able to get is contact resistance and mechanical info.
>>
>> matt
>
>--
>Scott McMorrow
>Principal Engineer
>SiQual, Signal Quality Engineering
>18735 SW Boones Ferry Road
>Tualatin, OR 97062-3090
>(503) 885-1231
>http://www.siqual.com
>
>

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