Re: [SI-LIST] : BGA socket modeling

Dima Smolyansky ([email protected])
Wed, 1 Sep 1999 16:46:53 -0700


In addition to what Scott said, differential TDR measurements will make the
task even easier. Furthermore, there is commercial software available that
extracts package interconnect models from TDR data.


Dima Smolyansky
Time Domain Analysis Systems, Inc.
7465 SW Elmwood St.
Portland, OR 97223
(503) 977-3629
(503) 804-7171 (mobile)
(503) 245-5684 (fax)
The Interconnect Modeling Company (TM)

-----Original Message-----
From: Scott McMorrow <[email protected]>
To: [email protected] <[email protected]>
Date: Wednesday, September 01, 1999 3:01 PM
Subject: Re: [SI-LIST] : BGA socket modeling

>Your best bet is to use a TDR to take actual measurements
>to create a model from. You will have to take measurements of
>all pins in order to get a useful bounds on the min and max
>"Matt (boomer) Russell" wrote:
>> Hi,
>> anyone have any approximate figures for BGA test socket LRC values
>> or how to model it.
>> I am trying to get info from the socket vendor, but all I seem
>> to be able to get is contact resistance and mechanical info.
>> matt
>Scott McMorrow
>Principal Engineer
>SiQual, Signal Quality Engineering
>18735 SW Boones Ferry Road
>Tualatin, OR 97062-3090
>(503) 885-1231

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