[SI-LIST] : Job Opportunity at Amkor Technology
Nozad Karim ([email protected])
Tue, 20 Jul 1999 17:00:17 -0700
Senior Packaging and Signal Integrity Engineer:
Participates in experiments and characterization in support of developing new
products based on High speed +Gb/s switching packages. Write, validate, and
maintain high-speed digital design and layout rules. Experience in package to
board level system design and analysis, and electrical modeling tools such as
ANSOFT, Pacific Numerix or other related tools. Apply various aspects of EDA
tools to improve the circuit layout process and eliminate layout errors. Work
with vendors to advance the capability of their tools to meet Amkor's needs.
This position requires a MSEE/Ph.D and +7 years of direct design experience with
chip sets, deep submicron VLSI design (such as GTL, PECL, and LVDS), and variety
data Bus structures. Thorough understanding EMI design rules, familiarity with
SPICE and good programming skills in UNIX environment with "C" or "Perl" are
also desirable.
If your interested, please send me your resume to:
Nozad Karim
Manager; Package Characterization
Amkor Technology Inc.
1900 S. Price Rd
Chandler, AZ. 85248
email: [email protected]
Voice: 480-821-5000
Fax: 480-821-6730
www.amkor.com
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