Vadim
-----Original Message-----
From: Lyke James Civ AFRL/VSSE [mailto:[email protected]]
Sent: Tuesday, July 20, 1999 2:33 PM
To: '[email protected]'
Subject: [SI-LIST] : Call for presentations, 3-D packaging advanced
technology worksho p
Is anyone out there interested in giving a talk to the 3-D packaging
community on the signal integrity implications of 3-D packaging, or future
trends in signal integrity that could impact 3-D packaging? The workshop
is in Chicago, Monday 25 October. I have conducted an Advanced Technology
Workshop for the International Microelectronics and Packaging Society
(IMAPS) for the last four years on 3-D, and I never have really got a good
discussion on this topic.
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