Just be sure to make the stack up symmetric to avoid warpage. Package pads,
escapes and break outs have to be done carefully (short, well thought out,
Results in all cases were lowest observed EMI, and the first PCB being
production worthy (i.e. No EMI, Mfg, Power Delivery or Signal integrity
issues). You have to do your homework up front and sit with the layout
person and walk them through the design, check, check and keep re-checking.
If you don't do your homework up front, board spins won't help you
(especially when all of the interconnect traces are buried)...you can't blue
wire! Of course, you HAVE to do the Signal Integrity analysis at these
frequencies and edge rates.
Regards, Dawson Yee
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