> -----Original Message-----
> From: Dave Hoover [SMTP:email@example.com]
> Sent: Thursday, July 08, 1999 4:55 PM
> To: 'firstname.lastname@example.org'
> Subject: [SI-LIST] : RF Design Question
> I'm fairly new to this group and really enjoy
> absorbing as much as I can from here. Being as
> I'm from the PCB fab side, I'm always tantalized
> (YANKED) into the electrical properties side
> of circuits/PCBs. Now I have a question.
> I have a customer (phone card manufacturer) who
> indicates that teardropping trace to pad junctions
> increases the the capacitance enough to completely
> change his EMC characteristics of the trace.
> Can this be so? (Sanity Check time)
> Next, there was ground pours around pads that had
> an octagon shape. We contourized the clearance which
> made it circular. Can this do the same EMC impact?
> In an industry where I've always been told that for
> reliability reasons we should always do the above
> mentioned for DFM. Now......in an RF environment the
> same reliability things change the designed in
> characteristics? I'm lost..........
> Any and all responses will be greatly appreciated.
> David Hoover
> Field Application Engineer
> McCurdy Circuits
> (714) 974-0401 ext 34
> (714) 974-3596 fax
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