Re: [SI-LIST] : RF Design Question

Bill Dempsey (bdempsey@dnaent.com)
Thu, 08 Jul 1999 17:50:19 -0500

Dave Hoover wrote:
>
> Hello,
> I'm fairly new to this group and really enjoy
> absorbing as much as I can from here. Being as
> I'm from the PCB fab side, I'm always tantalized
> (YANKED) into the electrical properties side
> of circuits/PCBs. Now I have a question.
> I have a customer (phone card manufacturer) who
> indicates that teardropping trace to pad junctions
> increases the the capacitance enough to completely
> change his EMC characteristics of the trace.
> Can this be so? (Sanity Check time)
Sanity check: The effect of the teardrop is
too close to nil to have an effect. The engineer needs
to look elsewhere for EMC probs. Ask him to compute
the % change in capacitance (if he knows how) then ask
him to correlate that with the "known" EMC effect.

Keep on truckin'

Regards,

Bill Dempsey
DNA Enterprises, Inc.

**** To unsubscribe from si-list: send e-mail to majordomo@silab.eng.sun.com. In the BODY of message put: UNSUBSCRIBE si-list, for more help, put HELP. si-list archives are accessible at http://www.qsl.net/wb6tpu/si-list ****