[SI-LIST] : RF Design Question
Dave Hoover (firstname.lastname@example.org)
Thu, 8 Jul 1999 13:54:48 -0700
I'm fairly new to this group and really enjoy
absorbing as much as I can from here. Being as
I'm from the PCB fab side, I'm always tantalized
(YANKED) into the electrical properties side
of circuits/PCBs. Now I have a question.
I have a customer (phone card manufacturer) who
indicates that teardropping trace to pad junctions
increases the the capacitance enough to completely
change his EMC characteristics of the trace.
Can this be so? (Sanity Check time)
Next, there was ground pours around pads that had
an octagon shape. We contourized the clearance which
made it circular. Can this do the same EMC impact?
In an industry where I've always been told that for
reliability reasons we should always do the above
mentioned for DFM. Now......in an RF environment the
same reliability things change the designed in
characteristics? I'm lost..........
Any and all responses will be greatly appreciated.
Field Application Engineer
(714) 974-0401 ext 34
(714) 974-3596 fax
**** To unsubscribe from si-list: send e-mail to email@example.com. In the BODY of message put: UNSUBSCRIBE si-list, for more help, put HELP. si-list archives are accessible at http://www.qsl.net/wb6tpu/si-list ****