Re: [SI-LIST] : Chip level Vs Board level SI

D. C. Sessions (dc.sessions@vlsi.com)
Thu, 15 Apr 1999 13:16:11 -0700

Arun Chandrashekar wrote:
>
> I need some information on factors that distinguish signal
> integrity problems at the chip level and at the board level.

At the simplest level, board level SI is dominated by capacitance
and inductance while chip level is dominated by capacitance and
resistance onchip and resistance and inductance at the I/O ring.

Because of this, board level designs have far more potential for
self-induced noise (eg reflections and ISI) in contrast to chip
level where crosstalk and SSO effects tend to play a greater
proportionate role.

> I
> personally feel that board level SI problems are more prominent as I do
> not have much idea about the chip level SI problems. Also, most articles
> I come across do not seem to address the SI problems at the chip level.

This probably says more about your reading habits than about the
state of the art/industry. Publications tend to specialize along
the lines of their intended readerships, and chip designers are
a different market from PWB designers. Thanks to the overwhelming
complexity of chip-level interconnect, chip-level SI *must* be
addressed at the automated tools level, so the discussions of
on-chip SI are mostly in the CAE fora.

-- 
D. C. Sessions
dc.sessions@vlsi.com

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