Consider bare die flip chip bga. TI has several papers on the use
of heat pipes and high power chips. This should enable you to cool
your system without having to go to the extremes of immersion or Peltier devices.
Use HP's internal search site:
with the words: "aluminum heat pipe"
The large C clamp in figure 6 indicates that this was experimental work at the time,
but the technology is available.
But keeping your devices cool will be easy compared to delivering a KW
with a low enough broadband impedance.
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