RE: [SI-LIST] : Package Parasitics Modelling

Andrew Ingraham ([email protected])
Mon, 29 Mar 1999 13:38:40 -0500

> Daniel Adar wrote:
> But it seems to me that using the RLC model (for any case) is

Not at all. If your package pin/bondwire has a big inductive loop, and
a lumped capacitance somewhere else, then the RLC model is completely

Trying to convert this into a distributed (t-line) equivalent is not the
right thing to do in that case.

Andy Ingraham

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