[SI-LIST] : 3rd International IEEE Workshop "Signal Propagation on Interconnects"

Hartmut Grabinski (hgra@lfi.uni-hannover.de)
Thu, 18 Mar 1999 06:22:07 +0100

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3rd International IEEE Workshop "Signal Propagation on Interconnects"

WWW Site: http://www.tet.uni-hannover.de/SPI/1999/prog99.htm

************************************************************************

PROGRAM

3rd IEEE Computer Society

WORKSHOP ON

SIGNAL PROPAGATION ON INTERCONNECTS

May 19-21, 1999
Titisee-Neustadt (Black Forest), Germany
MARITIM-TitiseeHotel

TUESDAY, MAY 18
Early Registration
6:00 PM - 8:00 PM
Welcome Reception and Buffet
6:00 PM - 9:00 PM

WEDNESDAY, MAY 19
Registration
8:00 AM - 5:00 PM

Opening Session
09:00 Welcome Address
J.P. Mucha, Univ. Hannover, GERMANY
09:10 Introduction
H. Grabinski, Univ. Hannover, GERMANY
09:30 Key Note Presentation: Recent Developments in Interconnect
Analysis and Simulation
E. Kuh, Univ. of Calif., Berkeley, USA

10:00 Coffee Break

Session 1: Modeling
10:30 Comparisons of RL and RLC Interconnect Models in the Simul
taneous Switching Noise Simulations
S. Hasan, J.L. Prince, A. Cangellaris, Univ. of Arizona, Tucson,
USA
11:00 Multilevel Multipoint Model-Reduction Algorithm for Macromo
deling of Multiport Distributed Networks
R. Achar, P.K. Gunupudi, M. Nakhla, Carleton Univ., Ottawa,
CANADA
11:30 Development of Scaleable Models for RF Structures in Mixed
Signal Packaging
A. Baldisserotto, Madhavan Swaminathan School of Electrical
and Comp. Eng., Atlanta, USA

12:30 Lunchbuffet

Session 2: Numerical Methods
14:00 Application of Parallel Computation to Full-Wave Interconnect
Extraction
F. Liu, J.E. Schutt-Ain=82, S. Velamparambil, W.C. Chew, Center
for Comp. Electromagnetics, Univ. of Illinois, Urbana, USA
14:30 FIT-Simulation of Optical Wave Propagation in Nonlinear and
Dispersive Media
S. Gutschling 1, H. Spachmann 2, T. Weiland 2, 1Siemens AG,
Munich, 2Univ. of Darmstadt, GERMANY
15:00 Characterization of Transmission Line Systems on Chip-, PCB-
and System Level
M. Vogt, W. John, FhG-IZM, Paderborn, GERMANY
15:30 Time-Domain Investigation of Decoupling Capacitors on MCM
A. Huber, J. Kiwitt, K. Rei=E1, Univ. of Karlsruhe, GERMANY

16:00 Coffee Break and Postersession

Session 3: Optical Interconnects
17:00 Operating at 1GB/s HIPPI 6400
H. Collins, R.E. Nikel, TriCN Associates LLC, San Francisco,
USA
17:30 Modelling of Optical Interconnections for Data Transmission
within High-Speed Electronic Systems
A. Wallrabenstein 1, Th. Bierhoff 1, A. Himmler 2, E. Griese 2,
G. Mrozynski 1, 1Univ.-GH Paderborn, 2Siemens AG IC C-LAB,
Paderborn, GERMANY
18:00 Quantifying the Impact of Optical Interconnect Latency on the
Performance of Optoelectronic FPGAs
J. Dambre, H. Van Marck, J. Van Campenhout, Univ. of Gent,
BELGIUM

THURSDAY, MAY 20
Registration
8:00 AM - 4:00 PM

Session 4: Parameter Extraction
08:30 Delay and Signal Integrity Impact of the Frequency Dependen
cy of the Transmission Line Parameters
S. B=94hringer, IBM Deutschland, B=94blingen, GERMANY
09:00 An Efficient Decomposition Algorithm for Full 3D Capacitance
Extraction of Large ULSI Interconnects
A. Rein, M. Frerichs, Siemens AG, Munich, GERMANY

09:30 Coffee Break

Session 5: Measurement Techniques
10:00 Electrical Characterization of Capacitors Integrated in Multi-
layer Printed Circuit Boards
A. Madou, L. Martens, Univ. of Gent, BELGIUM
10:30 Application of the Finite-Difference Time-Domain Method and
Measurement of Split Ground Plane Structures in Mixed Signal
Integrated Circuits and Packages
T.E. Moran, K.L. Virga, J.L. Prince, Univ. of Arizona, Tucson,
USA
11:00 Effect of a Metallic Ground Plane on Advanced CMOS On-
Chip Interconnections
J. Lescot 1, J. Haidar 1, A. Giry 2, F. Ndagijimana 1, 1LEMO-
UMR, Grenoble, 2CNET France Telecom, Meylan, FRANCE
11:30 0.1-10 GHz CMOS Voltage Standard
D.F. Williams, D.K. Walker, NIST, Boulder, USA

12:30 Lunchbuffet

Session 6: Radiation and Interference
14:00 Radiation Behaviour of Additional Copper Areas
M. B?cker, Incases Eng. GmbH, Paderborn, GERMANY
14:30 Considering Magnetic Interference in Board-Level Interconnect
Design
G. M?ller, J. Wendel, G. Stehr, K. Rei=E1, Univ. of Karlsruhe,
GERMANY
15:00 A Solution Approach for Transmission Lines in Close Proximity
Excited by an Incident Field
P. Nordholz, Univ. of Hannover, GERMANY

15:30 Coffee Break and Postersession

Session 7: Transmission Line Theory
16:30 Sensitivity Analysis Model of Transmission Line in Time-Do
main
W. Bandurski, A. Dobrza ski, Pozna Univ. of Technology,
POLAND
17:00 Characteristic Impedance, Causality, and Microwave Circuit
Theory
D.F. Williams, B.K. Alpert, NIST, Boulder, USA

19:30 Social Event: Enjoy the magic of the mountains in a typical
"Schwarzwald"-cabin with delicious regional treats.

FRIDAY, MAY 21

Session 8: System Design Issues
08:30 Using Wire Length Estimation to Predict Coupling Length in
VLSI Circuits
S. Koranne, Cadence Design Systems, Noida, INDIA
09:00 Input Shape Influence over Interconnect Performances
L.B. Kenmei 1, F. Huret 1, E. Paleczny 1, P. Kennis 1, G. Servel
2,
D. Deschacht 2, U.M.R. C.N.R.S., 1Villeneuve d=EFAscq, 2Mont
pellier, FRANCE
09:30 Behavioral Models of Digital Devices
I.S. Stievano, I.A. Maio, F.G. Canavero, Politecnico di Torino,
ITALY

10:00 Coffee Break

Session 9: Experimental Characterization
10:30 Fixturing of High Data Rate Memory ICs for Production Test
K. Helmreich, A. Lechner, Advantest (Europe) GmbH, Munich,
GERMANY
11:00 A Testchip for Analysis of Signal Integrity and On-Chip De
coupling Elements in Deep-Submicron Technology
T. Steinecke, Siemens AG, Munich, GERMANY
11:30 On-Chip Signal Integrity System Measurement for Complete
Deep Sub-micron Interconnect Characterization
F. Caignet 1, S. Delmas 1, E. Sicard 1, S. Saintot 2, J.G.
Ferrante 3, 1INSA, Toulouse, 2ST Microelectronics, Rousset,
3MATRA Systems and Information, Toulouse, FRANCE

12:00 Discussion and Summary
J.P. Mucha, Univ. Hannover, GERMANY

REGISTRATION FORM

WORKSHOP "SIGNAL PROPAGATION ON INTERCONNECTS"
MAY 19-21, 1999, TITISEE-NEUSTADT, GERMANY

To register, mail this form (or a copy of this form) with payment to:

Petra Nordholz
Laboratorium fuer Informationstechnologie
Schneiderberg 32
D-30167 Hannover, GERMANY

Phone: +49-511-762-5032
Fax: +49-511-762-5051
Email: petra@lfi.uni-hannover.de

Registrations via fax can be accepted only with credit card payment. The

workshop fee must be paid by credit card, check or cash. For check-
payments from non-German banks you have to pay a collection fee of
DM 30 in addition to the workshop fee.

Please type or print clearly:

Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Affiliation . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Mailing Address . . . . . . . . . . . . . . . . . . . . . . . . . .
.

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Zip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

City . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Country . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Fax . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Phone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Email . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

IEEE Membership No. . . . . . . . . . . . . . . . . . . . . . . . . . .
.

For payment by credit card please indicate:
American Express MasterCard VISA

Card Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Exp. Date . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Amount to be charged DM. . . . . . . . . . . . . . . . . . . . . . .
.

Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Date . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

WORKSHOP FEES

Registration
before April 15 after April 15

IEEE Member DM 530 DM 570
Non-member DM 650 DM 730

The registration fee includes: meals, workshop registration package,
refreshments, and social event. This is an unbreakable package.

ACCOMMODATION

Hotel reservations must be made directly with:

MARITIM TitiseeHotel
"IEEE Workshop"
Seestrasse 16
D-79822 Titisee-Neustadt
Tel.: +49-7651 80 80
Fax: +49-7651 80 86 03

There are special room rates for workshop attendees. Please be sure to
mention that you are attending the IEEE Workshop.

Standard (Forest side)
Single Room/day: DM 147
Double Room/day: DM 247

Comfort (Sea side)
Single Room/day: DM 167
Double Room/day: DM 267

A full breakfast menu is included in the room rates.

Since the number of rooms is limited in both categories reservations
should be made as soon as possible (before April 30) and can only
be accepted on a space available basis.

TRANSPORTATION

Titisee-Neustadt is located 20 km south-east of Freiburg, the inofficial

capital city of the Black Forest. Titisee can be reached via Freiburg
every
half hour by train through the romantic "H=94llental". There are direct
ICE
train connections from Frankfurt/M. every 2 hours or EC train
connections
from Frankfurt/M. via Mainz every hour to Freiburg (2=AB hours). In
addition
there are direct EC train connections from Basel (Switzerland) every
hour
to Freiburg (40 minutes).
The hotel is located 500 mtrs. from the railway station in Titisee.

WORKSHOP COMMITTEE

GENERAL CHAIR: J. P. Mucha, Univ. Hannover (D)
VICE CHAIR: T. W. Williams, Synopsys, Boulder (USA)
PROGRAM CHAIR: H. Grabinski, Univ. Hannover (D)
CO-CHAIR: P. Nordholz, Univ. Hannover (D)

TECHNICAL PROGRAM COMMITTEE

W. Bandurski, Univ. Pozna (PL)
F. Canavero, Univ. Torino (I)
D. De Zutter, Univ. Gent (B)
H. Dirks, Univ. Kiel (D)
H.-J. John, Siemens-Nixdorf, Paderborn (D)
W. John, FhG-IZM, Paderborn (D)
E. Kuh, Univ. of California, Berkeley (USA)
N. van der Meijs, Univ. Delft (NL)
J.P. Mucha, Univ. Hannover (D)
P. Nordholz, Univ. Hannover (D)
O.A. Palusinski, Univ. of Arizona, Tucson (USA)
H.J. Pfleiderer, Univ. Ulm (D)
L.T. Pileggi, Carnegie Mellon Univ., Pittsburgh (USA)
A. Simsek, FhG-IZM, Berlin (D)
K. Rei=E1, Univ. Karlsruhe (D)
A. Rubio, Univ. UPC Barcelona (E)
A.E. Ruehli, IBM Corp., Yorktown Heights (USA)
J. Schutt-Ain=82, Univ. of Illinois, Urbana (USA)
E. Sicard, INSA, Toulouse (F)
R. Velazco, TIMA, Grenoble (F)
D.F. Williams, NIST, Boulder (USA)
T.W. Williams, Synopsys, Inc., Boulder (USA)
Y. Zorian, Logic Vision Inc., San Jose (USA)

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***********************************************************************= *

  3rd International IEEE Workshop "Signal Propagation on Interc= onnects"
 

      WWW Site: http://www.tet.uni-hannover.de/SPI/1999= /prog99.htm

********************************************************************= ****

PROGRAM

3rd IEEE Computer Society

WORKSHOP ON

SIGNAL PROPAGATION ON INTERCONNECTS

May 19-21, 1999
Titisee-Neustadt (Black Forest), Germany
MARITIM-TitiseeHotel
 

TUESDAY, MAY 18
Early Registration
6:00 PM - 8:00 PM
Welcome Reception and Buffet
6:00 PM - 9:00 PM

WEDNESDAY, MAY 19
Registration
8:00 AM - 5:00 PM

Opening Session
09:00     Welcome Address
          J.P. Mucha, Univ. Hannover, GERMANY
09:10     Introduction
          H. Grabinski= , Univ. Hannover, GERMANY
09:30     Key Note Presentation: Recent Develop= ments in Interconnect
          Analysis and Simulation
          E. Kuh, Univ. of Calif., Berkeley, USA

10:00     Coffee Break

Session 1:     Modeling
10:30  Comparisons of RL and RLC Interconnect Models in the Simul
       taneous Switching Noise Simula= tions
       S. Hasan, J.L. Prince, A. Cangellaris, Univ. of Arizona, Tucson,
       USA
11:00  Multilevel Multipoint Model-Reduction Algorithm for Macromo
       deling of Multiport Distribute= d Networks
       R. Achar, P.K. Gunupudi, M. Nakhla, Carleton Univ., Ottawa,
       CANADA
11:30  Development of Scaleable Models for RF Structures in Mixed
       Signal Packaging
       A. Baldisserotto, Madhavan Swaminathan School of Electrical
       and Comp. Eng., Atlanta, USA

12:30  Lunchbuffet

Session 2:      Numerical Methods
14:00  Application of Parallel Computation to Full-Wave Interc= onnect
       Extraction
       F. Liu, J.E. Schutt-Ain=82, S. Velamparambil, W.C. Chew, Center
       for Comp. Electromagnetics, Univ. of Illinois, Urbana, USA
14:30  FIT-Simulation of Optical Wave Propagation in Nonlinear and
       Dispersive Media
       S. Gutschling 1, H. Spachmann 2, T. Weiland 2, 1Siemens AG,
       Munich, 2Univ. of Darmstadt, GERMANY
15:00  Characterization of Transmission Line Systems on Chip-, PCB-
       and System Level
       M. Vogt, W. John, FhG-IZM, Paderborn, GERMANY
15:30  Time-Domain Investigation of Decoupling Capacitors on MCM
       A. Huber, J. Kiwitt, K. Rei&aa= cute;, Univ. of Karlsruhe, GERMANY

16:00  Coffee Break and Postersession

Session 3: Optical Interconnects
17:00  Operating at 1GB/s HIPPI 6400
       H. Collins, R.E. Nikel, TriCN Associates LLC, San Francisco,
       USA
17:30  Modelling of Optical Interconnections for Data Transmis= sion
       within High-Speed Electronic Systems
       A. Wallrabenstein 1, Th. Bierh= off 1, A. Himmler 2, E. Griese 2,
       G. Mrozynski 1, 1Univ.-GH Paderborn, 2Siemens AG IC C-LAB,
       Paderborn, GERMANY
18:00  Quantifying the Impact of Optical Interconnect Latency on the
       Performance of Optoelectronic FPGAs
       J. Dambre, H. Van Marck, J. Van Campenhout, Univ. of Gent,
       BELGIUM

THURSDAY, MAY 20
Registration
8:00 AM - 4:00 PM

Session 4:  Parameter Extraction
08:30  Delay and Signal Integrity Impact of the Frequency Dependen
       cy of the Transmission Line Parameters
       S. B=94hringer, IBM Deutschlan= d, B=94blingen, GERMANY
09:00  An Efficient Decomposition Algorithm for Full 3D Capaci= tance
       Extraction of Large ULSI Inter= connects
       A. Rein, M. Frerichs, Siemens AG, Munich, GERMANY

09:30  Coffee Break

Session 5:  Measurement Techniques
10:00  Electrical Characterization of Capacitors Integrated in Multi-
       layer Printed Circuit Boards
       A. Madou, L. Martens, Univ. of Gent, BELGIUM
10:30  Application of the Finite-Difference Time-Domain Method and
       Measurement of Split Ground Plane Structures in Mixed Signal
       Integrated Circuits and Packag= es
       T.E. Moran, K.L. Virga, J.L. Prince, Univ. of Arizona, Tucson,
       USA
11:00  Effect of a Metallic Ground Plane on Advanced CMOS On-
       Chip Interconnections
       J. Lescot 1, J. Haidar 1, A. Giry 2, F. Ndagijimana 1, 1LEMO-
       UMR, Grenoble, 2CNET France Telecom, Meylan, FRANCE
11:30  0.1-10 GHz CMOS Voltage Standard
       D.F. Williams, D.K. Walker, NIST, Boulder, USA

12:30  Lunchbuffet

Session 6:  Radiation and Interference
14:00  Radiation Behaviour of Additional Copper Areas
       M. B?cker, Incases Eng. GmbH, Paderborn, GERMANY
14:30  Considering Magnetic Interference in Board-Level Interc= onnect
       Design
       G. M?ller, J. Wendel, G. Stehr= , K. Reiá, Univ. of Karlsruhe,
       GERMANY
15:00  A Solution Approach for Transmission Lines in Close Proximity
       Excited by an Incident Field
       P. Nordholz, Univ. of Hannover= , GERMANY

15:30  Coffee Break and Postersession

Session 7:  Transmission Line Theory
16:30  Sensitivity Analysis Model of Transmission Line in Time-Do
       main
       W. Bandurski, A. Dobrza ski, Pozna  Univ. of Technology,
       POLAND
17:00  Characteristic Impedance, Causality, and Microwave Circuit
       Theory
       D.F. Williams, B.K. Alpert, NIST, Boulder, USA

19:30  Social Event: Enjoy the magic of the mountains in a typical
       "Schwarzwald"-cabin with delic= ious regional treats.

FRIDAY, MAY 21

Session 8:  System Design Issues
08:30  Using Wire Length Estimation to Predict Coupling Length in
       VLSI Circuits
       S. Koranne, Cadence Design Systems, Noida, INDIA
09:00  Input Shape Influence over Interconnect Performances
       L.B. Kenmei 1, F. Huret 1, E. Paleczny 1, P. Kennis 1, G. Servel 2,
       D. Deschacht 2, U.M.R. C.N.R.S= ., 1Villeneuve dïAscq, 2Mont
       pellier, FRANCE
09:30  Behavioral Models of Digital Devices
       I.S. Stievano, I.A. Maio, F.G. Canavero, Politecnico di Torino,
       ITALY

10:00  Coffee Break

Session 9:  Experimental Characterization
10:30  Fixturing of High Data Rate Memory ICs for Production Test
       K. Helmreich, A. Lechner, Advantest (Europe) GmbH, Munich,
       GERMANY
11:00  A Testchip for Analysis of Signal Integrity and On-Chip De
       coupling Elements in Deep-Subm= icron Technology
       T. Steinecke, Siemens AG, Munich, GERMANY
11:30  On-Chip Signal Integrity System Measurement for Complet= e
       Deep Sub-micron Interconnect Characterization
       F. Caignet 1, S. Delmas 1, E. Sicard 1, S. Saintot 2, J.G.
       Ferrante 3, 1INSA, Toulouse, 2ST Microelectronics, Rousset,
       3MATRA Systems and Information= , Toulouse, FRANCE

12:00  Discussion and Summary
       J.P. Mucha, Univ. Hannover, GERMANY
 

REGISTRATION FORM

WORKSHOP "SIGNAL PROPAGATION ON INTERCONNECTS"
MAY 19-21, 1999, TITISEE-NEUSTADT, GERMANY

To register, mail this form (or a copy of this form) with payment to:

Petra Nordholz
Laboratorium fuer Informationstechnologie
Schneiderberg 32
D-30167 Hannover, GERMANY

Phone: +49-511-762-5032
Fax:   +49-511-762-5051
       Email: petra@lfi.uni-hannover.= de

Registrations via fax can be accepted only with credit card payment. The
workshop fee must be paid by credit card, check or cash. For check-=
payments from non-German banks you have to pay a collection fee of
DM 30 in addition to the workshop fee.

Please type or print clearly:

Name     . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Affiliation          . . . . . . . . . . . . . . . . . . . . . . . . . . .

Mailing Address      . . . . . . . . . . . . . . . . . . . . . . . . . . .

         . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Country      . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fax      . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Phone    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Email    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IEEE Membership No.  . . . . . . . . . . . . . . . . . . . . . . . . . . .
 

For payment by credit card please indicate:
  American Express    MasterCard  &nb= sp;  VISA

Card Number    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Exp. Date      . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Amount to be charged     DM. . . . . . . . . . . . . . . . . . . . . . . .

Signature      . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Date     . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
 

WORKSHOP FEES

           &n= bsp;    Registration
           &= nbsp;    before April 15    after April 15

IEEE Member     DM 530    &n= bsp;        DM 570
Non-member      DM 650   &n= bsp;         DM 730

The registration fee includes: meals, workshop registration package,=
refreshments, and social event. This is an unbreakable package.
 

ACCOMMODATION

Hotel reservations must be made directly with:

MARITIM TitiseeHotel
"IEEE Workshop"
Seestrasse 16
D-79822 Titisee-Neustadt
Tel.:     +49-7651 80 80
Fax:      +49-7651 80 86 03

There are special room rates for workshop attendees. Please be sure to
mention that you are attending the IEEE Workshop.

Standard (Forest side)
Single Room/day:    DM 147
Double Room/day:    DM 247

Comfort (Sea side)
Single Room/day:    DM 167
Double Room/day:    DM 267

A full breakfast menu is included in the room rates.

Since the number of rooms is limited in both categories reservations=
should be made as soon as possible (before April 30) and can only
be accepted on a space available basis.
 

TRANSPORTATION

Titisee-Neustadt is located 20 km south-east of Freiburg, the inoffi= cial
capital city of the Black Forest. Titisee can be reached via Freibu= rg every
half hour by train through the romantic "H=94llental". There are direct ICE
train connections from Frankfurt/M. every 2 hours or EC train conne= ctions
from Frankfurt/M. via Mainz every hour to Freiburg (2« hours)= . In addition
there are direct EC train connections from Basel (Switzerland) every hour
to Freiburg (40 minutes).
The hotel is located 500 mtrs. from the railway station in Titisee.=
 

WORKSHOP COMMITTEE

GENERAL CHAIR: J. P. Mucha, Univ. Hannover (D)
VICE CHAIR: T. W. Williams, Synopsys, Boulder (USA)
PROGRAM CHAIR: H. Grabinski, Univ. Hannover (D)
CO-CHAIR:   P. Nordholz, Univ. Hannover (D)

TECHNICAL PROGRAM COMMITTEE

W. Bandurski, Univ. Pozna  (PL)
F. Canavero, Univ. Torino (I)
D. De Zutter, Univ. Gent (B)
H. Dirks, Univ. Kiel (D)
H.-J. John, Siemens-Nixdorf, Paderborn (D)
W. John, FhG-IZM, Paderborn (D)
E. Kuh, Univ. of California, Berkeley (USA)
N. van der Meijs, Univ. Delft (NL)
J.P. Mucha, Univ. Hannover (D)
P. Nordholz, Univ. Hannover (D)
O.A. Palusinski, Univ. of Arizona, Tucson (USA)
H.J. Pfleiderer, Univ. Ulm (D)
L.T. Pileggi, Carnegie Mellon Univ., Pittsburgh (USA)
A. Simsek, FhG-IZM, Berlin (D)
K. Reiá, Univ. Karlsruhe (D)
A. Rubio, Univ. UPC Barcelona (E)
A.E. Ruehli, IBM Corp., Yorktown Heights (USA)
J. Schutt-Ain=82, Univ. of Illinois, Urbana (USA)
E. Sicard, INSA, Toulouse (F)
R. Velazco, TIMA, Grenoble (F)
D.F. Williams, NIST, Boulder (USA)
T.W. Williams, Synopsys, Inc., Boulder (USA)
Y. Zorian, Logic Vision Inc., San Jose (USA) --------------3B449728BB1AD165F9203094-- **** To unsubscribe from si-list: send e-mail to majordomo@silab.eng.sun.com. In the BODY of message put: UNSUBSCRIBE si-list, for more help, put HELP. si-list archives are accessible at http://www.qsl.net/wb6tpu/si-list ****