Re: [SI-LIST] : BGA vs Leaded - summary
Wed, 10 Mar 1999 07:39:40 -0600
Flip-chip has some real advantages, but not in all situations.
It does make things more expensive, because it puts more constraints
on the substrate technology, because it has to be underfilled, and
really because it's not in the high-volume flow yet.
It also takes away the flexibility of wirebonding (i.e. "bonding
options" at assembly) and probably means you won't be able to buy
a chip in 2 or 3 package options.
Electrically, it's a real winner IF designed properly. (hmm.. just
like a BGA...)
I think when the underfill problems are solved, we will see a lot
more flip-chip, even in low cost, high volume applications.
How long have we all been saying "Wirebonding has reached its limit"?
It hasn't happened yet.
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