An IC package pin is a nonuniform transmission line and
is characterized by impedance profile (known as z-profile
in IPA system: tekt. TDR software). When the IC
package pins are electrically small they can be modeled
with lumped elements. Modeling of these electrically small pins
as inductance or capacitor (or combination)
dependents upon the source and the termination resistance
connected at the ends of these lines. For all of these
nonuniform transmission line structures, the input impedance
is time/frequency dependent and cannot be approximated by a
constant until unless the package pin is
a uniform transmission line.
Regards,
Alok Tripathi.
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