From: Gary Otonari ([email protected])
Date: Fri May 18 2001 - 15:57:00 PDT
GigaTest is expanding it's engineering capability to include more TDR and other
time-domain tools and techniques. Most notably, we are expanding our Short Course
curriculum to include more of these "standard" techniques for Signal Integrity
engineering. Our next course on TDRs, TLines and Stackup Design, will be held on
June 19 and 20, here in Sunnyvale, CA. As with all of our classes, this course will
have lots of live measurement and simulation demos on real high-speed interconnects
like differential PCB traces and vias.
If you are interested in getting more info, please take a look at our website at:
Wesley Wu wrote:
> Hi All,
> Has anybody done characterization on existing BGA packages recently? I need to
> know if there is anyone who can do this for me and what is the estimated cost. The
> required measurements include characteristic impedance along traces, delay and
> gain on both directions of traces across the frequency band of 500M - 2GHz, ground
> bounce, cross talking, and ringing. I would like to obtain a data range for all
> these to see if some particular BGA packages are suitable for my applications.
> Ideally I would like to add some equivalent to bond wire and IC input capacitance
> during test. Your help is greatly appreciated.
> Wesley Wu
> RedSwitch, Inc.
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