RE: [SI-LIST] : BGA Pkg Characterization

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From: Larry Miller (ldmiller@rhapsodynetworks.com)
Date: Fri May 18 2001 - 07:22:48 PDT


You really do need to do this if you are contemplating usage up above 300
MHz. Many packages have simply awful resonances and crosstalk, and it varies
hugely with where you are on the package. I have found 4:1 variations in
lowest resonance frequencies in a single package due to the variations in
the way the signals get from the chip bonding pads to the balls. Also, you
need to test groups of signals. Various sets can resonate in pairs, etc.

Good luck!

Larry Miller

-----Original Message-----
From: Wesley Wu [mailto:wesley@redswitch.com]
Sent: Tuesday, May 15, 2001 8:23 PM
To: SI_LIST (E-mail)
Subject: [SI-LIST] : BGA Pkg Characterization

Hi All,

Has anybody done characterization on existing BGA packages recently? I need
to
know if there is anyone who can do this for me and what is the estimated
cost. The
required measurements include characteristic impedance along traces, delay
and
gain on both directions of traces across the frequency band of 500M - 2GHz,
ground
bounce, cross talking, and ringing. I would like to obtain a data range for
all
these to see if some particular BGA packages are suitable for my
applications.
Ideally I would like to add some equivalent to bond wire and IC input
capacitance
during test. Your help is greatly appreciated.

Wesley Wu
RedSwitch, Inc.
(408)719-4748

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