From: Javin Olson ([email protected])
Date: Mon Apr 30 2001 - 06:14:35 PDT
Your comment about making the via act like a transmission line is correct.
There are 2 ways that I know of to remove the stub caused by a via:
Blind vias - via stub is completely removed, but fabrication cost is
Counterboring - basically this method drills out the rest of the via, and it
adds about 25% to fabrication
Both methods obviously hurt the testability access to the board. The other
thing you can do is remove all non-functional pads within the via to reduce
the overall capacitance of the via.
I have one question about stripline and referencing in general: Is there a
benefit to having your high-speed diff-pair signal layers sandwiched between
2 GND layers? Are power layers generally a noisier reference?
Any thoughts on my last 2 questions would be appreciated...
Plexus Technology Group
From: [email protected]
[mailto:[email protected]]On Behalf Of [email protected]
Sent: Monday, April 30, 2001 5:56 AM
To: [email protected]; [email protected];
Subject: Re: [SI-LIST] : RE: 2.5 GHz in FR4
After reading all of the replies to the 2.5GHz questiion, I can see the
for using stripline to keep phaseshift constant on long runs. In trying
make the stubs a part of the transmission line, wouldn't it be advisable
utilise most of the via as part of the line by using the stripline located
the opposite side of a card from the IC?
Consider the 8 layer stackup shown here for clarification.
------- Sig and IC layer
------- Sig 2.5 GHz stripline
The stub resulting from the the unused portion of the via is reduced in
length. The trick would be to make the vias look like the transmission
Another thought--It seems like an imbedded microstrip line would possess
almost the same qualities of a stripline in terms of dielectric affecting
phaseshift. Can a card be made so that the vias would go only from the IC
layer to an imbedded microstrip layer directly below? This would get rid
any stubs. What do you think?
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