Re: [SI-LIST] : IC packaging modelling in IBIS

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From: Ozgur Misman (omism@amkor.com)
Date: Thu Mar 29 2001 - 14:11:52 PST


Hi Perry,
Yes. We do not only consider impedance control, we design impedance controlled
packages. These are typically, as you are pointing out BGA's or CSP,s with
internal ground planes. 4 layer PBGA package is quite common today, you can
select from a variety of stackup options to give you certain impedance with
reasonable width so the package can be routed.

A tolerance of +/-10% could be achieved.
If u need more info please contact me off-line.
Ozgur Misman
Amkor Technology

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A related question is the electrical design of IC packaging. For high
speed ASIC with large BGA packaging, do packaging vendors consider
impedance control on their substrate ?

Thanks in advance.

Perry Qu
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"Perry Qu" <perry.qu@alcatel.com> on 03/29/2001 02:49:42 PM

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A related question is the electrical design of IC packaging. For high
speed ASIC with large BGA packaging, do packaging vendors consider
impedance control on their substrate ?

Thanks in advance.

Perry Qu



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