Re: [SI-LIST] : Another bypassing question

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From: MikonCons@aol.com
Date: Sat Mar 24 2001 - 08:59:01 PST


Gary:

Definitely near the chip side. The power/ground sandwich will provide the
maximum initial rate of charge delivery to the IC and the chip capacitors
charge delivery will be limited/slowed by the via inductance from the bottom
layer to the top layer. The IC pin inductance will be a deterrent in both
cases.

Mike

Michael L. Conn
Owner/Principal Consultant
Mikon Consulting
(408)727-5697

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