[SI-LIST] : Splitting a lead carrying input or control signal in a memory package

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From: ֱ (cksd@sr.hei.co.kr)
Date: Thu Mar 22 2001 - 01:26:58 PST


Hi~ there,

I am simulating the package electrical properties for memory devices.

Usually, if a lead carrying input data signal has low capacitance, then I split its adjacent power or ground lead to reduce the distance between the lead and power or ground lead so that the lead can have proper capacitance.

The probem that I ask to you is that in case there are no adjacent power or ground lead near the lead with low capacitance, can I split the lead carrying input data or control signal to reduce the distance to its adjacent lead?

Thanks for your kind advice in advance.

Bye,

Kwang-Seong Choi
Packaging Engineer
Hyundai MicroElectronics Co. Ltd.

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