From: subramanya C K (email@example.com)
Date: Wed Mar 21 2001 - 02:20:07 PST
Hello all ,
I have the following query regarding the Board stackup:
If U were supposed to design a 12 layer board with superior EMC, which
stackup among the following would U prefer and why ?
STACKUP-1: S1 G S2 S3 P S4 S5 G S6 S7 P S8
STACKUP-2: S1 P S2 S3 G S4 S5 G S6 S7 P S8
*S = Circuit (routing) Layer ; P = Power Plane ; G = Ground Plane
Next, is there any hazzard due to the power noise in 3rd and 4th circuit
layers (S3 and S4) of the first topology ? if yes, what's the reason
behind that and how do U overcome it ?
(same for S7 and S8 of second stackup)
Finally, if I am given the liberty of increasing the number of power
planes on the cost of circuit layers (say 4:4), will it create any
crosstalk among the tarces on the four circuit layers ? (because now
there are more number of high speed tracks bunched nearer than before)
If yes, is there any go for that ?
Thanks and Regards,
Subramanya C K
Tel: +91-80-8520408 Ext: 4179
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