RE: [SI-LIST] : lossy transmission line model tool question

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From: Jian X. Zheng (jian@zeland.com)
Date: Mon Mar 05 2001 - 15:57:53 PST


Hi, Dennis:

I will suggest you to take a look at our MDSPICE 2.X mixed domain SPICE
simulator. The MDSPICE 2.X has an advanced s-parameter SPICE simulation
engine. It can perform high accuracy time domain simulation on ultra long
lossy transmission lines. The good features are: (1) It accepts any
frequency dependent and lossy models. (2) It normally guarantees the
causality condition. It also offers eye pattern display and non-linear
modeling on the MDSPICE 2.1 to be released. Thanks!

Best regards,

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Jian-X. Zheng, Ph.D
Zeland Software, Inc., 48890 Milmont Drive, 105D, Fremont, CA 94538, U.S.A.
Tel: 510-623-7162, Fax: 510-623-7135, Web: http://www.zeland.com
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Special Announcements: (1) IE3D 8.0 is released. The IE3D 8.0 has
implementation of boxed Green's functions, periodic Green's functions, and
advanced iterative matrix solvers for large structures. Using the AIMS
matrix solvers, you will be able to solve large RF IC and antenna array
problems. An example of an 8 by 8 antenna array takes less than 100 MB RAM
to solve on the AIMS III matrix solver. (2) The s-parameter SPICE simulator
MDSPICE 2.1 is going to be released. The MDSPICE 2.1 has a robust time
domain engine accepting s-parameters from full wave simulators. Its time
domain simulation normally can guarantee the casuality conditions for lossy
transmission lines longer than 1 foot. The MDSPICE 2.1 also features wide
band SPICE model extraction, eye pattern display and non-linear modeling for
both digital and analog circuits. (3) The FIDELITY 3.0 is formally released.
It has many good features to enhance 3D modeling in wireless communications.
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> -----Original Message----- > From: owner-si-list@silab.eng.sun.com > [mailto:owner-si-list@silab.eng.sun.com]On Behalf Of Goodrich, Dennis > Sent: Monday, March 05, 2001 3:10 PM > To: si-list@silab.eng.sun.com > Cc: Goodrich, Dennis > Subject: [SI-LIST] : lossy transmission line model tool question > > > I am just beginning to look at software tools that can generate lossy line > models for HSPICE that consider the stack-up geometries (3D) and multiple > materials used in high speed board technology. > > I'd appreciate suggestions from the group regarding accuracy (to measured > values), > and ease of use. > > Just what are folks using to generate their lossy line models for higher > frequencies > (1Ghz and above) using copper. > > I'll need to be able to FIND the software.. so I need brand name > as well as > company name > (or web site). > > thanks > > Dennis Goodrich > Engr Program Manager > TYCO Printed Circuits Group > Round Rock Division > 700 Jeffery Way > Round Rock, TX 78664 > 512.671.5203 > dgoodrich@tycoelectronics.com > > **** To unsubscribe from si-list or si-list-digest: send e-mail to > majordomo@silab.eng.sun.com. In the BODY of message put: UNSUBSCRIBE > si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP. > si-list archives are accessible at http://www.qsl.net/wb6tpu > **** >

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