RE: [SI-LIST] : SPICE Models from TDR Measurements

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From: Zabinski, Patrick J. (zabinski.patrick@mayo.edu)
Date: Thu Mar 01 2001 - 06:47:40 PST


Tim,

Here are a few references you might find valuable:

TITLE Time Domain Analysis of a Printed Circuit Board Via
AUTHOR Brock J. LaMeres and T. S. Kalkur
SOURCE Microwave Journal
DATE November 2000
PAGES 76-84

TITLE Differential Impedance Measurement With Time Domain Reflectometry
AUTHOR Eric Bogatin and Mike Resso
SOURCE Insight (an Agilent Technologies pub)
VOLUME 5
ISSUE 4
DATE 2000
PAGES 4-10

TITLE Electronic Package Failure Analysis Using TDR
AUTHOR NA
SOURCE TDA Systems Application Note
DATE 2000

TITLE Evaluating Microstrip With Time Domain Reflectometry
AUTHOR NA
SOURCE HP Application Note 1304-1 (#5968-0007E)
DATE 1998

TITLE Characterization of Differential Interconnects from TDR Measurements
AUTHOR N/A
SOURCE 1999 Time Domain Analysis Systems, Inc.
DATE May 1995

TITLE Characterization of Proximity Effects Between Interconnects
AUTHOR Alok Tripathi, V. K. Tripathi, J. Jong, and T. Arabi
SOURCE Proc of 1996 Int'l Symposium on Microelectronics
LOC Minneapolis Convention Center, Minneapolis, MN
DATE 8-10, October, 1996
PAGES 24-28

TITLE Equivalent Circuit Modeling of Interconnects From Time-Domain
Measuremen
ts
AUTHOR Jyh-Ming Jong, Bozidar Janko, and Vijai Tripathi
SOURCE IEEE Trans. on CHMT
VOLUME 16
NUMBER 1
DATE February, 1993
PAGES 119-126

TITLE IC Package and Interconnect Characterization Using Enhanced Accurac
Time
 Domain Reflectometry
AUTHOR Dmitry A. Smolyansky, Scott K. Diamond, Steven H. Pepper, and Vijai
K. T
ripathi
SOURCE (IEEE 0-7803-2411-0/94)
DATE 1994
PAGES 179-181

TITLE Lossy Interconnect Modeling From TDR/T Measurements
AUTHOR J. M. Jong, V. K. Tripathi, L. A. Hayden, and B. Janko
SOURCE IEEE 0-7803-2411-0/94
DATE 1994
PAGES 133-135

TITLE Measuring Package and Interconnect Model Parameters Using
Distributed Im
pedance
AUTHOR Bo Janko (Tektronix) and Peter Decher (Analogy)
SOURCE na
DATE na
PAGES 1-6

TITLE TDR Tools in Measuring Interconnects and Packages
AUTHOR B. Janko
SOURCE Tektronix Application Note

TITLE Time-Domain Characterization of Interconnect Discontinuities in
High-Spe
ed Circuits
AUTHOR Jyh-Ming Jong and Vijai K. Tripathi
SOURCE IEEE Trans on CHMT
VOLUME 15
NUMBER 4
DATE August, 1992
PAGES 497-504

TITLE Wide-Band Device Modeling Using Time-Domain Reflectometry
AUTHOR Seward T. Salvage, Bidyut Parruck, ans Sedki M. Riad
SOURCE IEEE Trans Instrum. Meas.
VOLUME IM-32
NUMBER 1
DATE March, 1983
PAGES 134-136

TITLE Z-Profile Algorithm
AUTHOR na
SOURCE Tektronix Technical Brief
DATE 1993

In addition, TDA Systems (www.tdasystems.com) makes commercial
tools that help extract SPICE models from TDR measurements.

Pat

>
> To all,
> As I am new to the SI field, I am looking for information on
> how to use
> TDR measurements of interconnects to make SPICE models.
> I have an overview of what needs to be done, but I'm looking for some
> more detailed support material/information.
> Thank you to anyone who can provide assitance.
>
> Tim Coyle
> Fairchild Semiconductor
 

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