Component Handling 1. Store components at room temperature in a dry, dust-free place, preferably in the original package. 2. Avoid dropping components. A fall to the floor subjects even the smallest device to many times the force of gravity. A dropped device may appear undamaged, but the force of impact may seperate internal connections and form tiny microcracks in the functional part of the device or its protective covering or coating. Cracks in the functional part of the device may render it useless, alter its specifications or degrade its performance. Cracks in the coating weaken the device and permit the entry of moisture. 3. Avoid overheating components when soldering or desoldering. Protect heat sensitive components with a soldering heat sink or pliers. Cool these components by blowing on them, but not the connection, after soldering. 4. To bend a component lead, grasp the lead with a long nose pliers near the device and then bend the lead with a finger. The radius of the bend should exceed the the diameter of the lead. Bending leads without pliers may form cracks between lead and device.