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Bonding within the ISBP suite should conform to Proxy Earth Protocol (PEP).
Line up bonding jumpers to pass current across the length and width of modules, and to parallel the GEC.
ISBP module bonding should of course include the GEC bonding to each module through the bus bar. If the modules are constructed as an in-line unit, then it will be easy to pass the GEC right on through.
The bonding of ISBPs together is a necessary force multiplier that decreases resistance and increases ampacity and responsiveness of the grounding system. Survivability is enhanced.
Fasteners for adjacent modules also will function as bonding devices, but this is not to be relied upon. Instead, run a system of bonding jumpers between modules, observing the long and short wavelengths within the ISBP suite. If there are positions remaining available on the bus bars after integrating all systems, then fill those across all modules as a parallel "bonding superhighway" to the GEC. This will reduce resistance within the ISBP and function as a director or drain for current flow exchange with the GEC.
There is no such thing as a "ground loop" where the ISBP is concerned. If redundant bonding and grounding is done in connection with an ISBP, then all is balanced and you have a low-resistance ground with high ampacity.
Having two bus bars per module, each parallel and passing the GEC through, would be ideal because enough bonding points would be available for the bonding superhighway as well as for future expansion needs of individual system modules.
Try to pass the GEC straight through the middle of the in-line modules without any large-angle bends (90+ degrees). Place the GEC in the center hole position of any bus bars.
The ISBP suite must be accessible, but enclosed. The enclosures will protect and extend the life of all bonds within the ISBP suite.
Enclosures could be as simple as a 4 X 4 steel box, but must be conductive in order to give electrical shielding. The enclosures and cover will also complement the ampacity and heat-transfer capability of the ISBP suite. Bonding the cover and or enclosure with a jumper to the ISBP module would be very prudent.
The largest practical bonding jumper or ground wire size should be used once you identify the two specific points for bonding. However, no jumper should be smaller than AWG 14, while AWG 12 is preferred as the minimum size.
Keep module covers clear for easy access. If you bond the cover from the inside, then leave the bonding jumper long enough for opening the cover and working inside the module.
Bonding jumpers should not block visual or manual access to the inside of an ISBP module.
Also called meshed grounding, meshed bonding installs different lengths of conductors within the ISBP that correspond to varying electrical wavelengths.
Bandwidth, described as the quantity of wavelengths supported, increases when meshed bonding is applied. A related concept is the application of ground radials within antenna systems.
With PEP and meshed bonding, the ISBP can more rapidly dissipate and balance out voltages and currents that arrive with varying wavelengths and differing rise and fall times.
Effects of meshed bonding and PEP to anticipate and look for at the ISBP include:
Proxy Earth Protocol (PEP) and meshed bonding are applied within the ISBP.
There are many tangible benefits obtained from the ISBP suite and from extensive use of bonding jumpers within each module and between modules. New installations and upgrades of grounding systems should not only install an ISBP, but should strive to incorporate as many tangible benefits as possible through dedicated application of Proxy Earth Protocol (PEP) and meshed bonding techniques.
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